imaginary_num6er@alien.topB to Hardware@hardware.watchEnglish · 10 months agoSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comexternal-linkmessage-square18fedilinkarrow-up13arrow-down10cross-posted to: hardware@lemmit.online
arrow-up13arrow-down1external-linkSK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing coreswww.tomshardware.comimaginary_num6er@alien.topB to Hardware@hardware.watchEnglish · 10 months agomessage-square18fedilinkcross-posted to: hardware@lemmit.online
minus-squareExist50@alien.topBlinkfedilinkEnglisharrow-up1·10 months agoThese are all in flip-chip packages. So no, power would come up through the bottom, and the transistors would be closest to the top.
These are all in flip-chip packages. So no, power would come up through the bottom, and the transistors would be closest to the top.